Equipment

E-Beam and Optical Lithography
2.       Mask Aligner
Thin Film Deposition
1.       HV Evaporator
2.       UHV Evaporator
Wet and Dry Etching
1.       ICP-RIE etcher (F)
2.       ICP-RIE etcher (Cl)
3.       Vapor HF
4.       Plasma Asher
5.       HF Wet bench
6.       Acid/Base Wet bench
7.       Solvent  Wet bench
Inspection and characterization
1.       Optical microscopes
2.       Profilometer
3.       DC probe station
4.       Ellipsometer
Microscopy and nanomanipulation
1.       FEI-SEM
2.       Plasma Xe FIB
BackEnd Processing
1.       Wire bonder
2.       Die Bonder
3.       RTA Oven
4.       Dicing saw