The Logitech PM6 precision lapping and polishing equipment can be used for thinning down samples like Si, quartz, SiGe, ect. Current maximum sample dimensions are up to 20 x 20 mm. For using the equipment and obtain training please contact the NFF staff that is responsible for the PM6. The equipment is located in the common tool area, room: I21.EG.R214.
Specifications
Sample dimensions: Up to 20 x 20 mm
Available lapping powder: Fused aluminium oxide – 5 μm and ultra fine aluminium oxide powder – 0.3 μm (MSDS).
Polishing: Logitech SF1 polishing fluid (MSDS). Alkaline Colloidal Silica, suitable for polishing wafers and a wide range of optical / optoelectronic components.
Tool Owner: S. Bagiante